ya the BGA chips are having a cold solder effect and they need to be reflowed, and then need to add extra cooling so that it wont happen again.
what pisses me off is no one thinks of these things when making there board designs and then leaves it up to the warrantee to repair the issues. its a mess with laptops i see so many terrible design where the motherboard flexes so much it causes issues to these BGA chips and various amounts of laptops come in without effective cooling.
remind you to stay away from "Sager" brand laptops, they dont know how to make a good design in any respect.
but the story goes, make a good design and make sure its good before it goes out. the xbox360 had a failure rate of 33% i belive, and thats massive in those terms. i think the ps3 was at 1 or 3% i dont remember what i heard the report about last week.
anyways anyone with access to a hot air rework station (here is an example of one
http://www.tequipment.net/HakkoFR1418-02.html ) can repair these and then put some added cooling on the chip when done (like its that easy, lol).